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US 2011/0030206 A1Published application
Micromodules including integrated thin film inductors and methods of making the same
AssigneeFairchild Semiconductor Corporation
InventorsFrancesco Carobolante, Douglas Alan Hawks
Life of this patent
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Abstract
Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor.
Claims24
1-22. (canceled)
A method of making a micromodule, the method comprising:
- assembling a component substrate comprising a thin film inductor and a semiconductor die together such that the semiconductor die is disposed over the thin film inductor;
- and
- assembling a plurality of conductive interconnect bumps on a plurality of interconnect pads disposed on the component substrate and located adjacent to one or more sides of the bumped die.
A method of making a micromodule, the method comprising:
- assembling a component substrate comprising a thin film inductor and a semiconductor die together such that the semiconductor die is disposed over a first surface of the component substrate;
- and
- assembling a plurality of conductive interconnect bumps on a plurality of interconnect pads disposed on a second surface of the component substrate.
Dependencies are inferred from the claim text.