Deposit protection cover and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorToshihiko Oyama
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AssigneeTokyo Electron Limited
InventorToshihiko Oyama
Estimating the term…
There are provided a deposit protection cover and a plasma processing apparatus capable of providing a simple solution to deposits adhered to a portion originally considered to be unreachable by plasma without increasing manufacturing cost. The deposit protection cover is detachably installed within a processing chamber for processing a substrate by generating plasma therein so as to cover a preset portion of the processing chamber. The cover includes an aluminum plate having a surface on which an anodic oxidation process is performed. Further, the anodic oxidation process is performed by using an electrode part protruded from a cover main body, an exposed area of an aluminum base surface is reduced by removing the electrode part after the anodic oxidation process is performed, and a cut surface formed after removing the electrode part is positioned at a region that is not directly exposed to the plasma within the processing chamber.
A deposit protection cover detachably provided within a processing chamber so as to cover a preset portion of the processing chamber that processes a substrate by generating plasma therein, the cover comprising:
A plasma processing apparatus including a processing chamber and processing a substrate by generating plasma therein, the apparatus comprising:
Dependencies are inferred from the claim text.