Back to results
US 2011/0023672 A1Published application
Method and Apparatus for Debonding a Submounted Substrate
AssigneeArizona Board of Regents, A Body Corporate of the State of Arizona Acting for and On Behalf of Arizona State University
InventorsRobert Blanchard, Steve R. Rednour, Douglas Loy
Life of this patent
Estimating the term…
Abstract
The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.
Claims31
An apparatus for debonding a submounted substrate comprising:
- an X-stage;
- a vacuum operated chuck attached to the X-stage, wherein the vacuum operated chuck is capable of receiving a submounted substrate;
- a Y-stage moveably coupled to the X-stage and oriented perpendicular to the X-stage;
- and
- a debonder coupled to the Y-stage, wherein the debonder comprises two mounting blocks and a cutting edge, wherein the two mounting blocks each have a distal end attached to the Y-stage such that the X-stage is capable of moving between the two mounting blocks, wherein the two mounting blocks each have a proximal end attached to an end of the cutting edge such that the cutting edge spans the X-stage, wherein the cutting edge is adjustable in height in a Z-axis.
2 more elements
A method for debonding a submounted substrate comprising:
- mounting a submounted substrate in a vacuum operated chuck attached to an X-stage, wherein the submounted substrate comprises a rigid carrier substrate bonded to a flexible substrate, wherein the X-stage is moveably coupled to a Y-stage;
- adjusting a debonder's height in a Z-axis such that the debonder is aligned with an interface between the rigid carrier substrate and the flexible substrate, wherein the debonder is coupled to the Y-stage, wherein the debonder comprises two mounting blocks and a cutting edge, wherein the two mounting blocks each have a distal end attached to the Y-stage such that the X-stage is capable of moving between the two mounting blocks, wherein the two mounting blocks each have a proximal end attached to an end of the cutting edge such that the cutting edge spans the X stage;
- bringing an upper plate comprising a vacuum-ring into contact with the flexible substrate;
- and
- debonding the flexible substrate from the rigid carrier substrate such that the debonder cuts through the interface between the rigid carrier substrate and the flexible substrate, wherein the vacuum-ring holds onto the flexible substrate via suction as the flexible substrate is debonded from the rigid carrier.
2 more elements
Physical computer readable storage media providing instructions stored in data storage and executable by a processor for causing an apparatus or system for debonding a submounted substrate to carry out functions including:
- transporting a submounted substrate for a predetermined distance;
- loading a submounted substrate into a debonding apparatus;
- applying a solvent drip to the submounted substrate;
- heating a cutting edge and/or a vacuum operated chuck;
- vibrating a debonder at ultrasonic frequencies;
- stabilizing the submounted substrate against an upper plate via a vacuum-ring;
- debonding the submounted substrate;
- replacing the debonder's cutting edge via a reel-to-reel system;
- and
- removing residual adhesive from the submounted substrate's rigid carrier substrate after debonding.
7 more elements
A system for debonding a submounted substrate comprising:
- a user interface;
- a conveyor system communicatively coupled to the user interface, wherein the conveyor system is operable to (i) transport a submounted substrate a predetermined distance and (ii) load the submounted substrate into a debonding apparatus;
- a solvent drip system communicatively coupled to the user interface, wherein the solvent drip system is operable to apply a solvent drip to the submounted substrate;
- a vibration system communicatively coupled to the user interface, wherein the vibration system is operable to vibrate a debonder at ultrasonic frequencies;
- a vacuum system communicatively coupled to the user interface;
- wherein the vacuum system is operable to stabilize the submounted substrate against an upper plate via a vacuum-ring;
- a debonding system communicatively coupled to the user interface, wherein the debonding system is operable to separate the submounted substrate into a flexible substrate and a rigid carrier substrate;
- a temperature control system communicatively coupled to the user interface, wherein the temperature control system is operable to heat the debonding system's cutting edge and/or vacuum operated chuck prior to debonding;
- a reel-to-reel system optionally communicatively coupled to the user interface, wherein the debonder is capable of replacing the cutting edge after use;
- and
- a cleaning system communicatively coupled to the user interface, wherein the cleaning system is operable to remove residual adhesive from the rigid carrier substrate after debonding.
8 more elements
Dependencies are inferred from the claim text.