Ductile multilayer silicone resin films

A microlayer die assembly, comprising:

• a plurality of die inserts deployed adjacent each other, each die insert comprising:
• first and second die insert components, each die insert component formed of first and second L-shaped sheets, each L-shaped sheet having first and second legs intersecting at approximately right angles to form an inner corner of the L-shaped sheet and an outer corner of the L-shaped sheet, the first and second L-shaped sheets being deployed perpendicular to each other and meeting at their respective inner corners, the first leg of each L-shaped sheet being bent so that a top edge of the leg is adjacent the outer corner of the other L-shaped sheet,
• the first and second die insert components being joined such that the second leg of the first L-shaped sheet in the first die insert component is parallel to and adjacent the second leg of the first L-shaped sheet in the second die insert component, and
• each of the plurality of die inserts being aligned along an axis that is in a first plane defined by the adjacent second legs of the first L-shaped sheets in the first and second die insert components, the axis also being in a second plane defined by adjacent second legs of the second L-shaped sheets in the first and second die insert components, the second plane being perpendicular to the first plane.

A system, comprising:

• a first source of a first silicon containing material;
• a second source of a second silicon containing material;
• and
• a multilayer die assembly configured to receive the first and second silicon containing materials from the first and second sources, respectively, and form a multilayer polymer stack comprising a plurality of alternating first and second layers formed of the first and second silicon containing materials, respectively, the multilayer die assembly comprising a plurality of die inserts, each die insert being configured to receive a first polymer stack comprising a first plurality of alternating layers of the first and second silicon containing materials and to provide a second polymer stack comprising a second plurality of alternating layers of the first and second silicon containing materials, the number of alternating layers in the second plurality being double the number of alternating layers in the first plurality.

A multilayered polymer material comprising alternating layers formed of a first silicon containing polymer and a second polymer, the multilayered polymer material being formed using a system, comprising:

• a first source of the first silicon containing polymer;
• a second source of the second polymer;
• and
• a multilayer die assembly configured to receive the first silicon containing polymer and the second polymer from the first and second sources, respectively, and form a multilayer polymer stack comprising a plurality of alternating first and second layers formed of the first silicon containing polymer and the second polymer, respectively, the multilayer die assembly comprising a plurality of die inserts, each die insert being configured to receive a first polymer stack comprising a first plurality of alternating layers of the first silicon containing polymer and the second polymer and to provide a second polymer stack comprising a second plurality of alternating layers of the first silicon containing polymer and the second polymer, the number of alternating layers in the second plurality being double the number of alternating layers in the first plurality.