Processing method for a workpiece
AssigneeCanon Kabushiki Kaisha
InventorAtsushi Numata
Life of this patent
Estimating the term…
Abstract
Provided is a processing method capable of accurately grasping a removal rate and coping with processing of an optical device or an optical device molding die, for which high shape accuracy is required. An ion beam as a tool is caused to scan a workpiece as a dummy work, and a dwell time of the tool at this time is changed based on a linear function with respect to a scanning position thereof and a removal rate with respect to the continuously changed dwell time is grasped based on an actually formed removal shape. The dwell time of the tool is changed based on the linear function with respect to the scanning position, and hence a removal rate based on the actual removal shape can be acquired continuously from a case where a scanning speed is fast to a case where the scanning speed is slow.
Claims2
A method for processing a workpiece in which a tool smaller than the workpiece is caused to scan the workpiece, the method comprising:
- causing the tool to scan a dummy work, and processing the dummy work while continuously changing a dwell time of the tool so that the dwell time is a linear function with respect to a scanning position of the tool;
- measuring a change of a depth or volume of a removal shape processed in the dummy work, to thereby determine a removal rate corresponding to a continuous change of the dwell time of the tool;
- and
- processing the workpiece while controlling a scanning speed of the tool based on a target shape of the workpiece and on the removal rate.
Dependencies are inferred from the claim text.