Solid state lighting device with improved heatsink
AssigneeCree LED Lighting Solutions, Inc.
InventorsWai Kwan Chan, Derek Ian Darley, Antony Paul Van De Ven, Gerald H. Negley
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AssigneeCree LED Lighting Solutions, Inc.
InventorsWai Kwan Chan, Derek Ian Darley, Antony Paul Van De Ven, Gerald H. Negley
Estimating the term…
A solid state lighting device includes at least one emitter and a forged heatsink arranged to receive and dissipate heat generated by emitter(s). The heatsink may have a thickness and/or profile that varies in at leats two dimensions. Fabrication of a solid state lighting device may include providing a forged heatsink, and mounting at least one solid state emitter in thermal communication with the heatsink. A space or object may be illuminated with a lighting device including at least one solid state emitter and a forged heatsink. The lighting device may be operated responsive to at least one sensor arranged to sense temperature and/or at least one characteric of light emitted by the emitter(s).
A lighting device comprising at least one solid state emitter and a forged heatsink in thermal communication with the at least one solid state emitter.
A method of fabricating a solid state lighting device, the method comprising:
A method comprising illumination of a space or object utilizing a lighting device comprising at least one solid state emitter and a forged heatsink in thermal communication with the at least one solid state emitter.
A heatsink adapted for use with a solid state lighting device to dissipate heat emanating from at least one solid state emitter, the heatsink comprising a forged body having a thickness and/or profile that varies in at least two dimensions.
A method of fabricating a heatsink adapted for use with a solid state lighting device to dissipate heat emanating from at least one solid state emitter, the method comprising forging of a thermally conductive heatsink material utilizing an impression die forming apparatus including at least two impression dies to vary the thickness and/or profile of the heatsink in at least two dimensions.
Dependencies are inferred from the claim text.