Low distortion package for a mems device including memory
AssigneeNanochip, Inc.
InventorsPeter David Ascanio, Tom P. Frangesh
Life of this patent
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Abstract
A package to receive a memory device including an electromagnetic motor comprises a body having a top surface and a bottom surface. Conductive leads extend through the body so that the conductive leads are at least partially exposed within the package. A base is connectable with the bottom surface of the body, and a lid is connectable with the top surface of the body. The base and the lid have substantially matched thermal expansion characteristics and provide magnetic flux return paths for the electromagnetic motor.
Claims20
A package to receive a microelectromechanical system comprising:
- a body having a top surface and a bottom surface;
- a plurality of conductive leads extending through the body so that the plurality of conductive leads are at least partially exposed within the package;
- a base connectable with the bottom surface;
- a lid connectable with the top surface;
- wherein the base and the lid have substantially matched thermal expansion characteristics;
- and
- wherein the base and the lid are magnetic flux return paths for the electromagnetic motor.
A system to storing information comprising:
- a stack including:
- a media substrate including a movable media in which indicia is formed;
- a tip substrate connected with the media substrate and including a plurality of tips extending from the tip substrate;
- wherein one or more of the tips is connectable with the media to detect the indicia;
- a cap connected with the media substrate so that the movable media is arranged between the cap and the tip substrate;
- an electromagnetic motor to controllably move the movable media;
- a package to receive the stack including:
- a body having a top surface and a bottom surface;
- a plurality of conductive leads extending through the body so that the plurality of conductive leads are at least partially exposed within the package;
- a base connectable with the bottom surface;
- a lid connectable with the top surface;
- wherein the base and the lid have substantially matched thermal expansion characteristics;
- and
- wherein the base and the lid are magnetic flux return paths for the electromagnetic motor.
A method to form a package to receive a memory device including an electromagnetic motor comprising:
- molding a body on a leadframe so that a plurality of leads extend through the body and are accessible from either side of the body;
- trimming the leadframe;
- fixedly connecting a base to the body, the base being comprised of a material providing a magnetic flux return path;
- fixedly connecting the memory device to the base;
- wire bonding the plurality of leads to bond pads of the memory device;
- fixedly connecting a lid to the body, the lid being comprised of a material providing a magnetic flux return path and having thermal expansion characteristics substantially similar to the base.
Dependencies are inferred from the claim text.