Electrodeposition of hard to deposit materials on aluminum and other substrates using improved water saving mercy cell

An amorphosus, nanocrystalline, microstructural, equiax, lamellar crystal structure, microstructural, single, polycrystalline, thin, ultra thin, or thick film of Fe—Mn, coherent bright electrodeposits of (a) Mn, Ni, and its alloys (Fe—Mn, Fe—Mn—Au, Mn—Ni—Au, Fe—Ni—Mn, Fe—Mn—Au, Fe—Mn—V) on a substrate selected from the group consisting of:

• Al2—, Al—Mn—MO, Ti, and Steel, wherein the film comprises one or more of the following characteristics:
• a. the film is bright, dark, and coherent on the substrate;
• b. the film electrodeposited is made up of a single crystal deposited structure, alloys of any Mn or Nickel, gold or Vanadium composition or intermediate composition;
• c. the film is deposited on activated ceramic alumina substrate and superconducting metal joint by use of filler metal suitable for brazing for hermetically sealed sensor assemblies applications;
• d. the film is depositable on superconducting tubes or pins and fused to glass ceramic such as alumina silica or borosilica suitable for use in hermetically sealed switch assemblies;
• e. the film has soft magnetic or hard magnetic properties;
• f. the film is depositable from ranges of temperatures from about 3 through 100 degrees Celsius or higher;
• g. the film comprises electrodeposition of hard to deposit metals, such as Vanadium, gold, on Ti or Al, Fe—Mn, Fe—NiCr, Fe—MnP, Fe—Mn—MO, Fe—Mn—Ni, Fe, Cu, and W substrate respectively without the use of cyanide or selenium;
• h. the film comprises electrodeposition of Mn, alloys such as Fe—Mn, Fe—MnCO, possessing soft or hard magnetic properties having wide ranges of hysteresis loop and interesting useful properties suitable for MEMS, micro relays, giant magneto resistive head manufacturing;
• magnetic shielding and X-radiation shielding applications;
• i. the film comprises electrodeposition of Mn, Fe—Mn having similar properties as Fe—Ni (invar), having low thermal coefficient of thermal expansion and low coefficient of friction useful for glass to metal fusion or metal to ceramic insulator joining;
• j. the film comprises electrodeposition of bright coherent Fe—Mn and
• Fe—Ni of intermediate composition or Mn and Ni at wt % Composition having various crystal microstructures from a simple salt bath ranging from about pH 3 through pH11.5, temperatures-14 through 100 deg. C. and above, for various aerospace, automotive, electronics and MEMS applications.