Signal conversion device with dual chip
AssigneePhytrex Technology Corporation
InventorsFeng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee
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Abstract
The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.
Claims14
A dual chip signal conversion device, comprising:
- a carrier comprising a first substrate, a second substrate and a connecting portion for connecting the first and second substrates, one side surface of the first substrate being provided with at least a first contact and a second contact while the other side surface of the first substrate being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts;
- a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts;
- a second chip disposed at one side surface of the carrier and electrically connected to the first chip;
- and
- an antenna disposed within the second substrate and electrically connected to the second chip.
A dual chip signal conversion device, comprising:
- a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts;
- a second substrate having a plurality of electrical contacts;
- a connecting portion for connecting the first and second substrates;
- a third substrate having a plurality of electrical contacts;
- a first chip electrically connected to the second and fourth contacts;
- a second chip;
- and
- an antenna disposed within the third substrate;
- wherein the second and third substrates are electrically connected via their respective plurality of electrical contacts.
Dependencies are inferred from the claim text.