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US 2010/0305897 A1Published application
Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis, and manufacture
AssigneeRudolph Technologies, Inc.
InventorJohn T. Strom
Life of this patent
Estimating the term…
Abstract
By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The information may then be used to troubleshoot, improve, and monitor the probing process.
Claims24
A method of analysis comprising:
- generating a merged data set, including the steps of:
- acquiring measured data representing one or more wafer probe marks relative to a defined location;
- acquiring measured data representing probe card pin overtravel;
- merging said measured data representing wafer probe mark and said measured data representing probe card pin overtravel to obtain said merged data set;
- optimizing said merged data set to minimize errors in said merged data set;
- and
- identifying one or more component errors and interactions based upon said merged data set.
4 more elements
A computer readable medium encoded with data and instructions for analyzing semiconductor manufacturing component error and interaction;
- said data and said instructions causing an apparatus executing said instruction to:
- generate a merged data set, including the steps of:
- acquiring measured data representing one or more wafer probe marks relative to a defined location;
- acquiring measured data representing probe card pin overtravel;
- merging said measured data representing wafer probe mark and said measured data representing probe card pin overtravel to obtain said merged data set;
- optimize said merged data set to minimize errors in said merged data set;
- and
- identify one or more component errors and interactions based upon said merged data set.
5 more elements
Dependencies are inferred from the claim text.