Ultra high-temperature plastic package and method of manufacture
OwnerMichael Zimmermaninventor
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OwnerMichael Zimmermaninventor
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A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame.
A liquid crystal polymer material comprising polymers that have been further polymerized by secondary polymerization after molding of the material into a shape, the material having a melting temperature greater than about 420° C. or having a molecular weight greater than about 30,000 gm/mol.
A liquid crystal polymer material produced by a method comprising the steps of:
A liquid crystal polymer material produced by a method comprising the steps of:
A liquid crystal polymer material comprising polymers that have been further polymerized by secondary polymerization and having a melting temperature greater than about 420° C.
A liquid crystal polymer material comprising polymers that have been further polymerized by secondary polymerization and having a molecular weight greater than about 30,000 gm/mol.
Dependencies are inferred from the claim text.