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US 2010/0304544 A1Published application
Front-end processing of nickel plated bond pads
AssigneeMicron Technology, Inc.
InventorsJohn Moore, Joseph F. Brooks
Life of this patent
Estimating the term…
Abstract
A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.
Claims22
1-17. (canceled)
A method of forming a bond pad comprising:
- forming integrated circuitry in a substrate;
- forming at least one dielectric layer over said integrated circuitry;
- removing at least part of said dielectric layer;
- forming said bond pad in an area where said dielectric layer was removed;
- forming an oxide layer over said at least one dielectric layer and said bond pad;
- removing the oxide layer in an area over the bond pad;
- and
- plating the bond pad with nickel.
5 more elements
23-57. (canceled)
A method of forming a device having a bond pad, said method comprising:
- forming a bond pad in an area of a dielectric material;
- forming an oxide layer over said dielectric layer and said bond pad;
- removing the oxide layer in an area over the bond pad;
- and
- plating the bond pad with nickel.
2 more elements
Dependencies are inferred from the claim text.