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US 2010/0304536 A1Published application
Dam composition for use with multilayer semiconductor package underfill material, and fabrication of multilayer semiconductor package using the same
AssigneeShin-Etsu Chemical Co., Ltd.
InventorKazuaki SUMITA
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Abstract
A composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle size of 0.1-10 μm and a maximum particle size of up to 75 μm, and (D) a surface-silylated silica having an average particle size of 0.005 μm to less than 0.1 μm is suited as a dam composition for use with a underfill material in the fabrication of multilayer semiconductor packages.
Claims13
A dam composition for use with a multilayer semiconductor package underfill material, comprising
- (A) 100 parts by weight of an epoxy resin,
- (B) 1 to 50 parts by weight of a curing agent,
- (C) 30 to 1,000 parts by weight of an inorganic filler having an average particle size of 0.1 to 10 μm and a maximum particle size of up to 75 μm, and
- (D) 1 to 20 parts by weight of a surface-silylated silica having an average particle size of 0.005 μm to less than 0.1 μm.
1 more element
A method for fabricating a multilayer semiconductor package comprising the steps of:
- placing a multilayer semiconductor chip assembly on a circuit board,
- applying a dam composition to mold a dam around the chip assembly on the circuit board,
- dispensing an underfill composition between the chip assembly and the dam so as to infiltrate between the circuit board and the chip assembly and between chips of the chip assembly, and
- curing both the dam composition and the underfill composition,
- said dam composition comprising
- (A) 100 parts by weight of an epoxy resin,
- (B) 1 to 50 parts by weight of a curing agent,
- (C) 30 to 1,000 parts by weight of an inorganic filler having an average particle size of 0.1 to 10 μm and a maximum particle size of up to 75 μm, and
- (D) 1 to 20 parts by weight of a surface-silylated silica having an average particle size of 0.005 μm to less than 0.1 μm.
6 more elements
Dependencies are inferred from the claim text.