Back to results
US 2010/0304534 A1Published application
Method for connecting a die attach pad to a lead frame and product thereof
AssigneeFairchild Semiconductor Corporation
InventorsErwin Ian V. Almagro, Honorio T. Granada, JR., Paul Armand Calo
Life of this patent
Estimating the term…
Abstract
Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
Claims3
A method for making a package comprising the steps of
- disposing a die attach pad with a plurality of conductive traces parallel to, but not co-planar with, a lead frame with leads that define a lead frame opening, wherein the die attach pad and lead frame are not mechanically connected;
- wirebonding the plurality of conductive traces of the die attach pad to the leads of the lead frame with a wire ribbon, thus making a connected assembly with a mechanical and electrical connection between the die attach pad and the lead frame using the ribbon,
- encapsulating the connected assembly in a molded housing such that a portion of the lead frame remains external to the molded housing.
Dependencies are inferred from the claim text.