Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device
AssigneeSeiko Epson Corporation
InventorNobuaki HASHIMOTO
Life of this patent
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Abstract
A method of manufacturing a semiconductor device, including the following steps, forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness, exposing an upper surface of the bump by removing a part of the resin layer right above the bump by exposing and then developing the resin layer, and bonding the semiconductor chip provided with a resin film formed of the resin layer face-down to a substrate, the bump of the semiconductor chip and a conductive section of the substrate being electrically connected by the resin film functioning as an adhesive.
Claims7
A method of manufacturing a semiconductor device, comprising:
- forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness;
- exposing an upper surface of the bump by removing a part of the resin layer right above the bump by exposing and then developing the resin layer;
- and
- bonding the semiconductor chip provided with a resin film formed of the resin layer face-down to a substrate, the bump of the semiconductor chip and a conductive section of the substrate being electrically connected by the resin film functioning as an adhesive.
Dependencies are inferred from the claim text.