Method of forming a semiconductor device package
AssigneeSamsung Electronics Co., Ltd.
InventorsChoongbin Yim, Seungkon Mok, Donghan Kim, Jin-Woo Park, PaLan Lee, Mi-yeon Kim
Life of this patent
Estimating the term…
Abstract
Provided is a method of forming a semiconductor package. In the method, a first package including a first chip on a first substrate is formed, a second package including a second chip on a second substrate is formed, a moulding cap provided with a via hole and a recess structure configured to receive the first chip is formed, and the second package is provided on the first package with the moulding cap being therebetween such that the recess receives the first chip. The via hole and the recess structure are simultaneously foamed.
Claims20
A method of forming a semiconductor package, the method comprising:
- forming a first package including a first chip on a first substrate;
- forming a second package including a second chip on a second substrate;
- forming a moulding cap provided with a via hole and a recess structure configured to receive the first chip;
- and
- providing the second package on the first package with the moulding cap being therebetween such that the recess structure receives the first chip,
- wherein the via hole and the recess structure are simultaneously formed.
A method of forming a semiconductor package, the method comprising:
- forming a first package including a first chip on a first substrate by mounting the first chip on the first substrate, electrically connecting the first substrate to the first chip through bonding bumps or bonding wires and forming a passivation material between the first substrate and the first chip and on a sidewall of the first chip;
- forming a second package including a second chip on a second substrate by mounting the second chip on the second substrate, electrically connecting the second substrate to the second chip through bonding bumps or bonding wires and forming a passivation material on the second substrate to mould the second chip;
- forming a moulding cap provided with via holes and a recess structure configured to receive the first chip, wherein the molding cap is formed using a mould comprising an upper mould and a lower mould and by injecting an epoxy moulding compound (EMC) into a formation region between the upper mould and the lower mould and then curing the EMC, wherein the lower mould is provided with a first projection for forming the recess structure and the upper mold is provided with a second projection for forming the via holes;
- adhering the moulding cap to an upper surface of the first package by an adhesive such that the recess structure receives the first chip therein;
- and
- providing the second package on a top surface of the moulding cap adhered to the first package such that the moulding cap is disposed between the first package and the second package.
A method of forming a semiconductor package, the method comprising:
- forming a first package including a first chip on a first substrate by mounting the first chip on the first substrate, electrically connecting the first substrate to the first chip through bonding bumps or bonding wires and forming a passivation material between the first substrate and the first chip and on a sidewall of the first chip;
- forming a second package including a second chip on a second substrate by mounting the second chip on the second substrate, electrically connecting the second substrate to the second chip through bonding bumps or bonding wires and forming a passivation material on the second substrate to mould the second chip;
- forming a moulding cap provided with via holes and a recess structure configured to receive the first chip, wherein the moulding cap is formed using a mold comprising an upper mould and a lower mould and by injecting an epoxy moulding compound (EMC) into a formation region between the upper mould and the lower mould and then curing the EMC, wherein the lower mould is provided with a first projection for forming the recess structure and a second projection for forming the via holes;
- adhering the moulding cap to an upper surface of the first package by an adhesive such that the recess structure receives the first chip therein;
- and
- providing the second package on a top surface of the moulding cap adhered to the first package such that the moulding cap is disposed between the first package and the second package.
Dependencies are inferred from the claim text.