Process for thick film circuit patterning

Abstract

The invention relates to forming an electrically functional pattern on a substrate and to a process for using a photosensitive element in combination with a sheet having a thick film composition applied to a support. The process for forming a pattern having electrically functional properties on a substrate comprises the steps of: (a) providing a photosensitive layer having a tacky surface disposed on a substrate; (b) image-wise exposing the photosensitive layer to form an imaged layer having tacky and non-tacky areas; (c) applying a sheet comprising at least one layer of a thick film composition disposed on a support to the imaged layer wherein the imaged layer is in contact with the thick film composition of the sheet; (d) heating the transfer sheet and the photohardenable layer to increase the adhesive strength between the thick film composition and tacky areas of the imaged layer; (e) removing the support wherein the thick film composition remains on the support in the non-tacky areas of the imaged layer and the thick film composition substantially adheres to the tacky areas of the imaged layer forming a patterned article; and (f) heating the thick film composition of the patterned article.

Dependencies are inferred from the claim text.