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US 2010/0304180 A1Published application
Bendable circuit structure for led mounting and interconnection
AssigneeE.I. du Pont de Nemours and Company
InventorsDaniel I. Amey, Deborah R. Gravely, Michael J. Green, Steven H. White
Life of this patent
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Abstract
This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.
Claims16
A laminate comprising, on a substrate the following layers:
- (e) a copper or aluminum metal layer;
- (f) a polyimide or adhesive layer, the metal layer being adjacent to the polyimide or the adhesive layer
- (g) a copper foil layer and
- (h) a liquid or film solder mask layer.
1 more element
Dependencies are inferred from the claim text.