Metallic laminate and manufacturing method of light emitting diode package using the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMyung Gun CHONG, Cheol Ho Heo, Sang Hyuk Son, Dae Hyung You
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Abstract
The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.
Claims9
A metallic laminate comprising:
- a core layer made of an insulating material;
- a metal layer disposed on one surface of the core layer;
- a heat radiating metal layer disposed on the other surface of the core layer;
- and
- a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.
A manufacturing method of a light emitting diode package comprising the steps of:
- preparing a metallic laminate including a core layer made of an insulating material, a metal layer disposed on one surface of the core layer, a heat radiating metal layer disposed on the other surface of the core layer, and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer;
- forming a circuit pattern electrically connected to a light emitting diode by patterning the metal layer;
- and
- mounting a light emitting diode device on the circuit pattern.
Dependencies are inferred from the claim text.