Polyimide composite material and film thereof
AssigneeMitsui Chemicals, Inc.
InventorsKenichi Fukukawa, Yoshihiro Sakata, Ichiro Fujio, Wataru Yamashita
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Abstract
A polyamic acid solution according to the present invention includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite according to the present invention is produced from the polyamic acid solution. The present invention provides a polyimide composite having a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.
Claims25
A polyamic acid solution (S2) comprising:
- a polyamic acid (PAA1) having the following general formula (1);
- (in the formula (1), X denotes a divalent organic group, and Y denotes a tetravalent organic group)
- a solvent (C) in which the polyamic acid (PAA1) is dissolved;
- and
- a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M).
Dependencies are inferred from the claim text.