Bonding method and bonded structure
AssigneeSeiko Epson Corporation
InventorsMitsuru SATO, Takatoshi YAMAMOTO
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Abstract
A bonding method includes: forming a liquid coating by supplying an epoxy-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; imparting energy to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film with developed adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
Claims16
A bonding method comprising:
- forming a liquid coating by supplying an epoxy-modified silicone material-containing liquid material onto at least one of a first base material and a second base material prepared beforehand to be bonded to each other via a bonding film;
- at least one of drying and curing the liquid coating to obtain the bonding film on the at least one of the first base material and the second base material;
- imparting energy to the bonding film to develop adhesion near a surface of the bonding film;
- and
- contacting the first base material and the second base material via the bonding film with developed adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
Dependencies are inferred from the claim text.