Method for laser-assisted bonding, substrates bonded in this manner and use thereof
AssigneeFraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
InventorsAndreas Tuennermann, Ramona Eberhardt, Gerhard Kalkowski, Stefan Nolte
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Abstract
The present invention relates to a method for laser-assisted bonding of substrates, in which these are connected together firstly frictionally by pressing together and subsequently strengthening of the connection between the substrates is effected by activation in regions which is induced by laser irradiation. The invention likewise relates to substrates produced accordingly.
Claims32
1-27. (canceled)
A method for laser-assisted bonding of substrates, in which two substrates are connected together by being brought in direct contact and strengthening of the connection between the substrates is effected subsequently by activation in regions which is induced with laser irradiation at the interface between the substrates, the melting or transformation temperature of the substrates not being reached during the activation.
Dependencies are inferred from the claim text.