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US 2010/0303271 A1Published application
Silicon microphone package
AssigneeGeneral Mems Corporation
InventorYunlong Wang
Life of this patent
Estimating the term…
Abstract
A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween.
Claims28
A silicon microphone package, comprising:
- an integrated microphone die having opposing first and second surfaces;
- a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;
- and
- a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween.
1 more element
A silicon microphone package, comprising:
- an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element and a cavity;
- a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;
- an acoustic opening formed in a portion of the first cover member, partially exposing the integrated microphone die;
- and
- a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die.
2 more elements
A silicon microphone package, comprising:
- an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element and a cavity;
- a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween;
- a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die;
- and
- an acoustic opening formed in a portion of the second cover member, partially exposing the integrated microphone die.
2 more elements
Dependencies are inferred from the claim text.