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US 2010/0302876 A1Published application
Package apparatus and method of operating the same
AssigneeHynix Semiconductor Inc.
InventorSang Kyu Lee
Life of this patent
Estimating the term…
Abstract
A package apparatus includes at least one memory chip, a voltage detection circuit configured to make a determination of whether a voltage supplied to the memory chip is a specific voltage or higher, and a controller configured to control an operation of the memory chip based on a result of the determination.
Claims18
A package apparatus, comprising:
- at least one memory chip;
- a voltage detection circuit configured to make a determination of whether a voltage supplied to the memory chip is a specific voltage or higher;
- and
- a controller configured to control an operation of the memory chip based on a result of the determination.
1 more element
A package apparatus, comprising:
- a memory chip comprising a CAM cell for storing an option information;
- a controller comprising a voltage detection circuit for checking whether a voltage supplied to the memory chip is a specific voltage or higher, wherein the controller inputs a command to the memory chip for loading the option information stored in the CAM cell, after the voltage detection circuit has checked that the voltage supplied to the memory chip is the specific voltage or higher.
A method of operating a package apparatus, including a controller and at least one memory chip including a CAM cell, the method comprising:
- inputting a power source;
- making a determination via the controller whether a voltage supplied to the memory chip has reached a specific voltage;
- and
- controlling an operation of the memory chip by inputting via the controller a command to the memory chip for loading an option information stored in the CAM cell if, as a result of the determination, the voltage supplied to the memory chip is determined to have reached the specific voltage.
1 more element
Dependencies are inferred from the claim text.