Method of manufacturing electronic device and electronic device
AssigneeSeiko Epson Corporation
InventorTetsuya OTSUKI
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an electronic device, the method includes: preparing a first lead frame having a first lead, the first lead having a first portion located in a first region; electrically connecting the first lead and a first electronic part; bending the first lead such that the first portion is located outside the first region; arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region; and electrically connecting the second lead and the second electronic part.
Claims7
A method of manufacturing an electronic device, the method comprising:
- preparing a first lead frame having a first lead, the first lead having a first portion located in a first region;
- electrically connecting the first lead and a first electronic part;
- bending the first lead such that the first portion is located outside the first region;
- arranging a second lead frame to overlap the first lead frame such that a second portion of a second lead of the second lead frame is located in the first region;
- and
- electrically connecting the second lead and a second electronic part.
A method of manufacturing an electronic device, the method comprising:
- preparing a lead frame having a first lead and a second lead, the first lead having a first portion located in a first region and the second lead having a second portion located in the first region;
- placing a first electronic part at the first portion;
- bending the first lead such that the first portion is located outside the first region;
- and
- placing a second electronic part at the second portion.
An electronic device comprising:
- a first lead frame having a first lead bent at a first point;
- a second lead frame having a second lead;
- a first electronic part mounted at a first portion between the first point and a front end of the first lead;
- and
- a second electronic part mounted at a second portion of the second lead,
- wherein the second lead frame is arranged to overlap the first lead frame, and
- a first distance from the first point to the second electronic part is shorter than a second distance from the first point to the front end of the first lead.
An electronic device comprising:
- a lead frame having a first lead bent at a first point and a second lead;
- a first electronic part mounted at a first portion between the first point and a front end of the first lead;
- and
- a second electronic part mounted at a second portion of the second lead,
- wherein a first distance from the first point to the second electronic part is shorter than a second distance from the first point to the front end of the first lead.
Dependencies are inferred from the claim text.