Thin-film probe sheet and method of manufacturing the same, probe card, and semiconductor chip inspection apparatus

A thin-film probe sheet comprising:

• a plurality of contact terminals electrically connected to electrodes arranged to an inspected object;
• individual wirings led out from the contact terminals through through-holes in an insulating layer;
• and
• a plurality of peripheral electrodes connected to electrodes of a wiring board, wherein
• a base material sheet forming the thin-film probe sheet has a region in which the plurality of contact terminals are formed, the region being positioned at a lower position than a surface of a peripheral region of the region.

A thin-film probe sheet comprising:

• a plurality of contact terminals electrically connected to electrodes arranged to an inspected object;
• individual wirings led out from the contact terminals through through-holes in an insulating layer;
• and
• a plurality of peripheral electrodes connected to electrodes of a wiring board, wherein
• a second metal film and a third metal film which are selectively removable are provided in a peripheral region of a first metal film which forms the plurality of contact terminals;
• and
• the third metal film is formed like a step on the second metal film by shifting the third metal film to outside the contact terminal, so that a periphery of the contact terminals is covered with a resin base material which forms an insulating film.

A method of manufacturing a thin-film probe sheet including:

• a plurality of contact terminals electrically connected to electrodes arranged to an inspected object;
• individual wirings led out from the contact terminals through through-holes in an insulating layer;
• and a plurality of peripheral electrodes connected to electrodes of a wiring board,
• the method comprising the steps of :
• forming a second metal film in peripheral regions of hole portions to which the plurality of contact terminals are formed, and then forming a first metal film forming the plurality of contact terminals;
• forming a resist which covers the first metal film;
• forming a third metal film on the second metal film, and then removing the resist;
• forming the wiring connected to the first metal film, and then forming a protective layer which protects the wiring;
• and
• removing the second metal film and the third metal film.