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US 2010/0301484 A1Published application
Lga substrate and method of making same
OwnerOmar J. Bchir, Munehiro Toyama +2inventors
InventorsOmar J. Bchir, Munehiro Toyama, Charan Gurumurthy, Tamil Selvy Selvamuniandy
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Abstract
An LGA substrate includes a core (110), having build-up dielectric material (150), at least one metal layer (125), and solder resist (155) formed thereon, an electrically conductive land grid array pad (120) electrically connected to the metal layer, a nickel layer (121) on the electrically conductive land grid array pad, a palladium layer (122) on the nickel layer, and a gold layer (123) on the palladium layer.
Claims6
An LGA substrate comprising:
- a core having build-up dielectric material, at least one metal layer, and solder resist formed thereon;
- an electrically conductive land grid array pad electrically connected to the metal layer;
- a nickel layer on the electrically conductive land grid array pad;
- a palladium layer on the nickel layer;
- and
- a gold layer on the palladium layer.
3 more elements
Dependencies are inferred from the claim text.