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AssigneesFraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., Technische Universitaet Chemnitz
InventorsThomas Waechtler, Thomas Gessner, Stefan Schulz, Heinrich Lang, Alexander Jakob
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A method can be used for the production of a coated substrate. The coating contains copper. A copper precursor and a substrate are provided. The copper precursor is a copper(I) complex which contains no fluorine. A copper-containing layer is deposited by means of atomic layer deposition (ALD) at least on partial regions of the substrate surface by using the precursor. Optionally, a reduction step is performed in which a reducing agent acts on the substrate obtained in the layer deposition step. In various embodiments, the precursor is a complex of the formula L2Cu(X∩X) in which L are identical or different σ-donor-π acceptor ligands and/or identical or different σ,π-donor-π acceptor ligands and X∩X is a bidentate ligand which is selected from the group consisting of β-diketonates, β-ketoiminates, β-diiminates, amidinates, carboxylates and thiocarboxylates.
A method for producing a coated substrate, the method comprising:
A substrate comprising a closed copper coating that has no fluorine-containing impurities, wherein the copper coating has a layer thickness of from 2 nm to 30 nm.
A substrate comprising a closed copper- and copper oxide-containing coating, that has no fluorine-containing impurities, wherein the copper- and copper oxide-containing coating has a layer thickness of from 2 nm to 30 nm and wherein the coating substantially comprises Cu2O in a surface region and wherein a gradient with decreasing oxygen content is present between the surface and the substrate.
Dependencies are inferred from the claim text.