Stacked package and method for forming stacked package
AssigneeKabushiki Kaisha Nihon Micronics
InventorMasato Ikeda
Life of this patent
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Abstract
A semiconductor chip module including a plurality of semiconductor chips, each provided on the side face thereof with a part of connection terminals coupled with a circuit pattern formed on the front face, the chips being stacked and bonded. The stacked element in the lowermost layer is a semiconductor chip or an interposer dedicated for attachment to an external attachment board, and having a plurality of electrode elements (e.g., solder balls) arranged on a face on the attachment side, with each electrode element connected to any one of the connection terminals by a circuit pattern. Connection terminal portions on the side faces of the respective semiconductor chips and the stacked element in the lowermost layer are interconnected by a wiring pattern extending over the side faces.
Claims18
A stacked package in which a plurality of stacked package elements, each provided on the side face thereof with a part of connection terminals coupled with a circuit pattern formed on the front face, have been stacked and bonded,
- wherein said stacked package element in the lowermost layer is dedicated for attachment to an external attachment board, having a plurality of electrode elements arranged on a face on the attachment side and connecting said each electrode element to any one of said connection terminals by a circuit pattern, and
- wherein the stacked package element in the lowermost layer is configured so that connection terminal portions on the side faces of the respective stacked package elements arranged on a face on the attachment side are interconnected by a wiring pattern extending over the side faces.
A method for forming a stacked package in which a plurality of stacked package elements, each provided on the side face thereof with a part of connection terminals coupled with a circuit pattern formed on the front face, have been stacked and bonded, comprising:
- a first step of forming, on each of said stacked package elements, said connection terminals led at least from the front face to the side face to be coupled with said circuit pattern formed on the front face;
- a second step of stacking and bonding by adhesive said plurality of stacked package elements on each of which said connection terminals have been formed;
- a third step of interconnecting connection terminal portions on the side faces of said bonded respective stacked package elements by a wiring pattern;
- and
- a fourth step of forming, on a face on the attachment side of said stacked package element in the lowermost layer, a plurality of electrode elements to be connected to any one of said connection terminals by a circuit pattern.
Dependencies are inferred from the claim text.