Forming Semiconductor Chip Connections
AssigneeInternational Business Machines Corporation
InventorsLouis Lu-Chen Hsu, Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, John A. Fitzsimmons
Life of this patent
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Abstract
Systems and methods are disclosed that enable forming semiconductor chip connections. In one embodiment, the semiconductor chip includes a body having a polyhedron shape with a pair of opposing sides; and a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.
Claims25
A semiconductor chip comprising:
- a body having a polyhedron shape with a pair of opposing sides;
- and
- a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape.
A method of forming a first semiconductor chip, the method comprising:
- depositing a plurality of dielectric layers over a chip body having a polyhedron shape with a pair of opposing sides;
- etching the plurality of dielectric layers to form a hole and etching the plurality of dielectric layers and the chip body to create a through silicon via (TSV) opening;
- dicing the chip body through the TSV opening, forming a plurality of semiconductor chips;
- depositing a solder layer in the hole, forming a solder ball element;
- depositing the solder layer in the TSV opening and in a space between the plurality of semiconductor chips;
- and
- cutting through a portion of the solder member and the solder layer in the space between the plurality of semiconductor chips, forming a solder member extending along a side that extends between the pair of opposing sides of the chip body.
A semiconductor structure comprising:
- a plurality of semiconductor chips, each semiconductor chip including:
- a body having a polyhedron shape with a pair of opposing sides;
- and
- a solder member extending along a side that extends between the pair of opposing sides of the polyhedron shape;
- the plurality of semiconductor chips being connected at the solder member of each of the plurality of semiconductor chips.
A method of forming a first semiconductor structure, the method comprising:
- connecting a plurality of semiconductor chips, each semiconductor chip including:
- a body having a polyhedron shape with a pair of opposing sides;
- a solder member extending between the opposing sides of the polyhedron shape;
- and
- a solder ball element located on a surface of one of the pair of opposing sides;
- the connecting including:
- heating the solder ball element of the first semiconductor chip and heating the solder ball element of the second semiconductor chip;
- and
- compressing the solder ball element of the first semiconductor chip against the solder ball element of the second semiconductor chip.
A semiconductor structure comprising:
- a plurality of semiconductor chips, each semiconductor chip including:
- a body having a polyhedron shape with a pair of opposing sides;
- a first solder member extending between the opposing sides of the polyhedron shape;
- and
- a solder ball element located on a surface of one of the pair of opposing sides;
- the plurality of semiconductor chips being connected to each other by the solder ball element of each of the semiconductor chips;
- and
- a first connector chip including:
- a body having a polyhedron shape with a pair of opposing sides;
- a solder member extending between the opposing sides of the polyhedron shape;
- and
- a solder ball element located on a surface of one of the pair of opposing sides;
- the first connector chip being connected to each of the plurality of semiconductor chips.
Dependencies are inferred from the claim text.