Component built-in wiring board and manufacturing method of component built-in wiring board

A component built-in wiring board, comprising:

• a first insulating layer;
• a second insulating layer positioned in a laminated state on the first insulating layer;
• a semiconductor chip buried in the second insulating layer, having a terminal pad;
• a wiring pattern sandwiched between the first insulating layer and the second insulating layer, including a mounting land for the semiconductor chip and having a roughened surface on a side of the second insulating layer;
• a conductive bump sandwiched between the terminal pad of the semiconductor chip and the mounting land of the wiring pattern, electrically and mechanically connecting the terminal pad with the mounting land;
• and
• a resin disposed between the semiconductor chip and both the first insulating layer and the wiring pattern.

A manufacturing method of a component built-in wiring board, comprising:

• patterning a metallic foil laminated on a first insulating plate to form a wiring pattern including lands to mount a semiconductor chip;
• roughening a surface of the wiring pattern including the lands;
• flip connecting a semiconductor chip having terminal pads and conductive bumps formed on the terminal pads with positions of the conductive bumps aligned with positions of the lands of the wiring pattern roughened;
• and
• integrating a second insulating plate different from the first insulating plate in a laminated state on the first insulating plate to bury the flip-connected semiconductor chip into the second insulating plate.

A component built-in wiring board, comprising:

• an intermediate board having an insulating plate and a wiring pattern formed on the insulating plate;
• a semiconductor chip mounted on the intermediate board via the wiring pattern;
• and
• a multilayer wiring board having an insulating layer in which the intermediate board and the semiconductor chip are buried, and having an inner wiring layer formed within the insulating layer to electrically conduct to the wiring pattern.