Electronic component and manufacturing method thereof

A manufacturing method of an electronic component that is connected to either one of an interconnection substrate and other electronic component via a conductive bump, the manufacturing method comprising:

• forming a metal layer on a principle face of the electronic component on which have been formed a pad and a passivation film, the pad being made of a conductive material and being arranged in a first bump formation region that is two-dimensionally arranged in center of the principle face and in a second bump formation region that is linearly arranged at peripheral border of the principle face, the passivation film covering the principle face except a formation position of the pad;
• applying a resist on the metal layer and forming, by lithography technique, an opening corresponding to the formation position of the pad;
• forming, by plating technique, a bump metal layer on the metal layer inside the opening;
• removing the resist;
• removing, by etching technique, the metal layer using the bump metal layer as a mask;
• and
• forming a bump by subjecting the bump metal layer to reflow treatment, wherein
• the forming the opening comprises forming the opening at the second bump formation region with radius that is smaller than radius of at least some of the openings at the first bump formation region, and
• the forming the bump metal comprises forming the bump metal layer that has thickness smaller than radius of the opening.

An electronic component in which an element is formed on a chip, the electronic component comprising:

• a pad that is made of a conductive material and that is formed in a first bump formation region that is two-dimensionally arranged in center of one principle face and in a second bump formation region that is linearly arranged at peripheral border of the principle face;
• a passivation film that is formed on the principle face to cover portion except a formation position of the pad;
• a metal layer that is formed on the pad;
• and
• a bump that is made of a conductive material and that is formed on the metal layer by plating, wherein
• radius of the metal layer in the second bump formation region is smaller than radius of at least some of the metal layer in the first bump formation region.