Integrated circuit packaging system with interposer interconnections and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing an integrated circuit;
• mounting a routing structure having a functional side above the integrated circuit;
• mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure;
• forming an encapsulation that encapsulates the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and the vertical interconnect extends through the encapsulation from the surface of the routing structure to a topmost surface of the encapsulation with a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure;
• forming mold risers in the encapsulation that rise vertically away from the routing structure;
• and
• connecting an external-package to the surface exposed from the encapsulation between the mold risers.

An integrated circuit packaging system comprising:

• an integrated circuit;
• a routing structure having a functional side mounted above the integrated circuit;
• a vertical interconnect mounted to the functional side of the routing structure and the vertical interconnect extends vertically away from the routing structure;
• and
• an encapsulation that encapsulates the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and the vertical interconnect extends through the encapsulation from the surface of the routing structure to a topmost surface of the encapsulation with a surface of the routing structure remains exposed from the encapsulation, and a portion of the vertical interconnect remains exposed from the encapsulation above the surface of the routing structure.