Semiconductor device and method of manufacturing the same
AssigneeElpida Memory, Inc.
InventorsMitsuhisa WATANABE, Keiyo Kusanagi, Koichi Hatakeyama, Hiroyuki Fujishima
Life of this patent
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Abstract
A semiconductor device may include, but is not limited to a wiring board, a first insulator, a semiconductor chip, and a second insulator. The first insulator penetrates the wiring board. A top end of the first insulator is higher in level than an upper surface of the wiring board. The semiconductor chip is disposed on the top end of the first insulator. The semiconductor chip is separated from the upper surface of the wiring board. The second insulator covers the semiconductor chip and the upper surface of the wiring board.
Claims20
A semiconductor device comprising:
- a wiring board;
- a first insulator penetrating the wiring board, a top end of the first insulator being higher in level than an upper surface of the wiring board;
- a semiconductor chip on the top end of the first insulator, the semiconductor chip being separated from the upper surface of the wiring board;
- and
- a second insulator covering the semiconductor chip and the upper surface of the wiring board.
A method of manufacturing a semiconductor device, comprising:
- preparing a motherboard having a plurality of through-holes;
- attaching a support board onto the motherboard, the support board having a plurality of protruding portions, the plurality of protruding portions being inserted into the plurality of through-holes, so that top ends of the plurality of protruding portions are higher in level than an upper surface of the motherboard;
- fixing a plurality of semiconductor chips to the top ends of the plurality of protruding portions so that the plurality of semiconductor chips are separated from the upper surface of the motherboard;
- forming a first insulator covering the plurality of semiconductor chips;
- removing the support board;
- and
- forming a second insulator so as to fill a plurality of spaces into which the plurality of protruding portions have been inserted, the second insulator being connected to the first insulator.
Dependencies are inferred from the claim text.