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US 2010/0301467 A1Published application
Wirebond structures
OwnerAlbert Wuinventor
Life of this patent
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Abstract
Embodiments of the present disclosure provide an apparatus comprising a semiconductor die, a bond pad formed on the semiconductor die, the bond pad comprising aluminum (Al), a bonding material comprising gold (Au) coupled to the bond pad, the bonding material covering at least a portion of the bond pad, and a wire coupled to the bonding material, the wire comprising copper (Cu). Other embodiments may be described and/or claimed.
Claims20
An apparatus comprising:
- a semiconductor die;
- a bond pad formed on the semiconductor die, the bond pad comprising aluminum (Al);
- a bonding material comprising gold (Au) coupled to the bond pad, the bonding material covering at least a portion of the bond pad;
- and
- a wire coupled to the bonding material, the wire comprising copper (Cu).
2 more elements
A method comprising:
- forming a bond pad on a semiconductor die, the bond pad comprising aluminum (Al);
- depositing a bonding material comprising gold (Au) to cover at least a portion of the bond pad;
- and
- bonding a wire to the bonding material, the wire comprising copper (Cu).
1 more element
A semiconductor package comprising:
- a semiconductor die;
- a bond pad formed on the semiconductor die, the bond pad comprising aluminum (Al);
- a bonding material comprising gold (Au) coupled to the bond pad, the bonding material covering at least a portion of the bond pad;
- a wire coupled to the bonding material, the wire comprising copper (Cu);
- and
- a package substrate electrically coupled to the semiconductor die via the wire.
3 more elements
Dependencies are inferred from the claim text.