Asterisk pad
OwnerMohamad Ashraf bin Mohd Arshadinventor
Life of this patent
Estimating the term…
Abstract
A method and structure for a semiconductor device can include a chip support having a one or more elongated structures formed in the chip support The elongated structures, which have a width and a length greater than the width, receive chip attach material such as epoxy during a chip attach process. Because each elongated feature is oriented such that an axis through a center of the length of each elongated feature points to a center of the chip support, the chip attach adhesive flows into the feature with minimal trapping of air. Trapped air can cause delamination of the chip from the chip support, or cracking of the chip and device failure.
Claims15
1-7. (canceled)
A semiconductor device comprising:
- a semiconductor chip;
- a leadframe comprising a chip pad, wherein the chip pad comprises:
- a surface;
- a center;
- and
- an elongated feature located in the surface of the chip pad, wherein:
- the elongated feature comprises a length and a width;
- the length is longer than the width;
- and
- the elongated feature is oriented such that an axis through a center of the length of the elongated feature extends through the center of the chip pad;
- and
- chip attach adhesive interposed between the chip and the chip pad, and within the elongated feature.
A method for forming a semiconductor device, comprising:
- dispensing a quantity of chip attach adhesive onto a center of a chip support;
- placing a semiconductor chip into the chip attach adhesive;
- applying an opposing force between the chip and the chip support, wherein during the application of the opposing force, the chip attach adhesive flows into an elongated feature located in a surface of the chip support, the elongated feature having a width and a length longer than the width, and the elongated feature being oriented such that an axis through a center of the length of the elongated feature points to the center of the chip support.
A semiconductor device comprising:
- a semiconductor chip affixed to a surface of a chip support;
- wherein the chip support includes a first plurality of elongated features disposed on the chip support;
- and
- each elongated feature having a width, a length that is greater than the width, and a depth extending inwardly from the surface of the chip support and which increases gradually from an edge at the chip support surface towards an interior of the elongated feature;
- and
- a chip attach adhesive between the semiconductor chip and the chip support, and in each elongated feature.
Dependencies are inferred from the claim text.