Method for applying a structure to a semiconductor element
AssigneeFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorsOliver Schultz-Wittmann, Filip Granek, Andreas Grohe
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Abstract
A method for applying a predetermined structure of a structural material to a semiconductor element. The method includes the following steps: A) partially covering a surface of the semiconductor element with a masking layer, B) applying a film of a structural material to the masking layer and to the surface of the semiconductor element in the zones that are devoid of the masking layer and C) removing the masking layer together with the structural material present on the masking layer. The method according to the invention provides that between process steps B and C, the film of structural material is partially removed in a process step B2.
Claims17
Method for depositing a predetermined structure made from a structural material onto a semiconductor element, comprising the following steps:
- A) partially covering a surface of the semiconductor element with a masking layer,
- B) depositing a film made from the structural material onto the masking layer and onto a surface of the semiconductor element in areas spared from the masking layer,
- B2) partially removing the film made from the structural material, and
- C) stripping the masking layer with the structural material located on the masking layer.
Dependencies are inferred from the claim text.