Solid-state image pickup device, method of manufacturing the same and electronic apparatus
AssigneeSony Corporation
InventorsAkiko Ogino, Yukihiro Sayama, Takayuki Shoya, Masaya Shimoji
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
Claims9
A solid-state image pickup device comprising:
- a trench formed in an insulating film above a light-receiving portion;
- a first waveguide core portion provided on an inner wall side of the trench;
- a second waveguide core portion filled in the trench via the first waveguide core portion;
- and
- a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
A solid-state image pickup device manufacturing method comprising the steps of:
- forming a trench in an insulating film formed above a light-receiving portion;
- forming a first waveguide core portion on an inner wall side of the trench;
- filling the trench with a photosensitive material via the first waveguide core portion;
- and
- forming a second waveguide core portion with the photosensitive material partially left in the trench through exposure and development of the photosensitive material and forming a rectangular lens with the photosensitive material partially rectangularly left above the trench.
A solid-state image pickup device manufacturing method comprising the steps of:
- forming a trench in an insulating film formed above a light-receiving portion;
- forming a first waveguide core portion on an inner wall side of the trench;
- filling the trench with an organic material via the first waveguide core portion;
- coating a photosensitive material on the organic material and exposing and developing the photosensitive material to leave a pattern of the photosensitive material above the trench;
- and
- etching the organic material by use of the pattern of the photosensitive material as a mask to form a second waveguide core portion with the organic material partially left in the trench and to form a rectangular lens with the organic material partially rectangularly left above the trench.
An electronic apparatus comprising:
- a solid-state image pickup device;
- and
- a signal processing portion processing a signal
- based on electric charge created by the solid-state image pickup device;
- wherein the solid-state image pickup device includes
- a trench formed in an insulating film above a light-receiving portion,
- a first waveguide core portion provided on an inner wall side of the trench,
- a second waveguide core portion filled in the trench via the first waveguide core portion, and
- a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.
Dependencies are inferred from the claim text.