Sensor geometry for improved package stress isolation

A sensor, comprising:

• a sensor die including a diaphragm and one or more sensing elements coupled to the diaphragm;
• a sensor package for housing the sensor die;
• a backing plate situated between the sensor die and the sensor package, a first side of the backing plate facing the sensor die and a second side of the backing plate facing the sensor package;
• the backing plate including a cavity;
• and
• the backing plate defines a wall between at least part of the cavity and the second side of the backing plate, making the backing plate less rigid and allowing the backing plate to absorb more stress.

A method for improving package stress isolation in a sensor package assembly, comprising:

• providing a bore through a backing plate;
• providing a counterbore along only part of the bore of the backing plate to improve stress isolation of the backing plate, wherein the counterbore enters a first side of the backing plate and decreases a stiffness of the backing plate;
• mounting a sensor die adjacent to the first side of the backing plate and adjacent the counterbore, thereby forming a backing plate/sensor die assembly, wherein the sensor die includes a diaphragm that in fluid communication with the counterbore and bore of the backing plate;
• and
• mounting the backing plate/sensor die assembly in a sensor package to form the sensor package assembly, wherein the sensor package includes a sensor port that is in fluid communication with the diaphragm via the counterbore and bore of the backing plate.