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US 2010/0301374 A1Published application
Led package structure
AssigneeEverlight Electronics Co., Ltd.
InventorSsu-Yuan Weng
Life of this patent
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Abstract
An LED package structure includes a lead frame, an LED chip disposed on the lead frame, a fuse disposed on the lead frame and electrically connected to the lead frame, and an encapsulation. The fuse is electrically connected to the LED chip in series.
Claims11
A light emitting diode (LED) package structure, comprising:
- a lead frame;
- an LED chip disposed on the lead frame;
- a fuse disposed on the lead frame and electrically connected to the lead frame, the fuse being electrically connected to the LED chip in series;
- and
- an encapsulation covering the LED chip, the fuse and at least a part of the lead frame.
2 more elements
Dependencies are inferred from the claim text.