Light emitting diode module and manufacture method thereof

Abstract

A manufacture method of light emitting diode (LED) module includes: providing a carrier board including a carrying area and a shaping area; arranging at least one substrate having at least one circuit layer in the carrying area of the carrier board; arranging at least one LED in the carrying area of the carrier board; electrically connecting the LED to the circuit layer of the substrate; encapsulating the LED and at least part of the circuit layer by at least one light transmissive encapsulation element; and fabricating the shaping area of the carrier board into a desired appearance. The above-mentioned carrier board not only can be a heat sink but also can be easily fabricated into various types of design shapes. Therefore, a light emitting diode module manufactured by the above-mentioned method has preferred heat dissipation effects and a better appearance with relatively low production costs.

Dependencies are inferred from the claim text.