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US 2010/0301359 A1Published application
Light Emitting Diode Package Structure
OwnerMing-Hsiung Liuinventor
Life of this patent
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Abstract
An LED package structure with good heat dissipation, includes a metal plate having at least one recess, a heat-conducting insulating layer directly formed on a surface of the metal plate, a conductor layer directly formed on a surface of the heat-conducting insulating layer, at least one LED chip disposed on a bottom surface of the recess and electrically connected to the conductor layer, and at least one optical lens covering the recess. The heat-conducting insulating layer is oxides or nitrides of the metal plate.
Claims5
An light emitting diode (LED) package structure, comprising:
- a metal plate having a surface with at least one recess;
- a heat-conducting insulating layer directly formed on a surface of the metal plate;
- a conductor layer directly formed on a surface of the heat-conducting insulating layer;
- at least one LED chip disposed on a bottom surface of the recess and electrically connected to the conductor layer;
- and
- at least one optical lens covering the recess;
- wherein the heat-conducting insulating layer is oxides or nitrides of the metal plate.
4 more elements
An LED package structure, comprising:
- a metal plate having a surface with at least one recess;
- a heat-conducting insulating layer directly formed on a surface of the metal plate;
- a conductor layer directly formed on a surface of the heat-conducting insulating layer;
- at least one LED chip disposed on a bottom surface of the recess and electrically connected to the conductor layer;
- and
- at least one optical lens covering the recess;
- wherein the metal plate is made of made of aluminum and the heat-conducting insulating layer is made of ceramic materials including alumina.
4 more elements
Dependencies are inferred from the claim text.