Interferometric fiber optic gyroscope with silicon optical bench front-end
AssigneeHoneywell International Inc.
InventorsLee Strandjord, Jenni Strabley, James F. Detry
Life of this patent
Estimating the term…
Abstract
Method and apparatus are provided for a silicon substrate optical system for use in an interferometric fiber optic gyroscope (IFOG). A silicon substrate of the silicon substrate optical system is etched to receive optical components, including an input optical fiber, a pump source, a wavelength division multiplier, an isolator, a polarizing isolator, a beam splitting device, a PM tap coupler, a relative intensity noise (RIN) photodiode, a system photodiode, and an output optical fiber. The optical components are mounted on a silicon substrate to reduce the size and cost of the IFOG and increase reliability.
Claims12
A silicon substrate optical system comprising:
- a silicon substrate, wherein the silicon substrate defines one or more recesses configured to receive one or more isolators in optical alignment, one or more pedestals configured to receive one or more photodiodes or one or more pump sources in optical alignment, one or more V-grooves configured to receive one or more optical fibers in optical alignment, one or more pyramidal trenches configured to receive one or more beam splitters in optical alignment, one or more slots configured to receive one or more polarizing isolators in optical alignment, and one or more vias configured to receive one or more wavelength division multipliers in optical alignment, all aligned for use in an interferometric fiber optic gyroscope (IFOG).
A method of fabrication of a silicon substrate optical system, the method comprising:
- etching a silicon substrate, wherein etching the silicon substrate defines one or more recesses configured to receive one or more isolators, one or more pedestals configured to receive one or more photodiodes or one or more pump sources, one or more V-grooves configured to receive one or more optical fibers, one or more pyramidal trenches configured to receive one or more beam splitters, one or more slots configured to receive one or more polarizing isolators, or one or more vias configured to receive one or more wavelength division multipliers, all in optical alignment;
- mounting by fluidic assembly the one or more isolators in the silicon substrate defining the one or more recesses, the one or more photodiodes or the one or more pump sources on the silicon substrate defining the one or more pedestals, the one or more optical fibers in the silicon substrate defining the one or more V-grooves, the one or more beam splitters in the silicon substrate defining the one or more pyramidal trenches, the one or more polarizing isolators in the silicon substrate defining the one or more slots, or the one or more wavelength division multipliers in the silicon substrate defining the one or more vias, all in optical alignment;
- bonding via an adhesive the one or more isolators to the silicon substrate defining the one or more recesses, the one or more photodiodes or the one or more pump sources to the silicon substrate defining the one or more pedestals, the one or more optical fibers to the silicon substrate defining the one or more V-grooves, the one or more beam splitters to the silicon substrate defining the one or more pyramidal trenches, the one or more polarizing isolators to the silicon substrate defining the one or more slots, or the one or more wavelength division multipliers to the silicon substrate defining the one or more vias;
- and
- curing the adhesive.
Dependencies are inferred from the claim text.