Wafer level led package structure for increasing light-emitting efficiency and heat-dissipating effect and method for manufacturing the same

A method for making a wafer level LED package structure for increasing light-emitting efficiency and heat-dissipating effect, comprising:

• providing a wafer having a plurality of light-emitting units, wherein each light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive conductive layer and a negative conductive layer both formed on the light-emitting body, and a light-emitting area formed in the light-emitting body;
• cutting one part of the light-emitting body in order to expose peripheral area of a top surface of the substrate body;
• forming a reflecting layer between the positive conductive layer and the negative conductive layer and on the peripheral area of the top surface of the substrate body in order to cover external sides of the light-emitting body and expose the positive conductive layer and the negative conductive layer;
• respectively forming a plurality of first conductive units on the light-emitting units, wherein each first conductive unit has a first positive conductive layer formed on the corresponding positive conductive layer and a first negative conductive layer formed on the corresponding negative conductive layer;
• and
• respectively forming a plurality of second conductive units on the first conductive units, wherein each second conductive unit has a second positive conductive structure formed on the corresponding first positive conductive layer and a second negative conductive structure formed on the corresponding first negative conductive layer.