Nitride semiconductor wafer, nitride semiconductor chip, and method of manufacture of nitride semiconductor chip
AssigneeSharp Kabushiki Kaisha
InventorsTakeshi Kamikawa, Masataka Ohta
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AssigneeSharp Kabushiki Kaisha
InventorsTakeshi Kamikawa, Masataka Ohta
Estimating the term…
A nitride semiconductor chip is provided that offers enhanced luminous efficacy as a result of an improved EL emission pattern. The nitride semiconductor laser chip (nitride semiconductor chip) has an n-type GaN substrate having as a principal growth plane a plane having an off-angle in the a-axis direction relative to the m plane, and a nitride semiconductor layer formed on the principal growth plane of the n-type GaN substrate. The n-type GaN substrate includes a depressed portion (carved region), which is carved from the principal growth plane in the thickness direction, and an uncarved region, which is a region not carved. The nitride semiconductor layer formed on the n-type GaN substrate has a gradient thickness region whose thickness decreases in a gradient fashion toward the depressed portion (carved region) and an emission portion formation region whose thickness varies very little. In the emission portion formation region 6, a ridge portion is formed.
A nitride semiconductor wafer comprising:
A nitride semiconductor chip comprising:
A method of manufacture of a nitride semiconductor chip, comprising:
Dependencies are inferred from the claim text.