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US 2010/0301338 A1Published application
Thin film device, flexible circuit board including thin film device, and method for manufacturing thin film device
AssigneeSeiko Epson Corporation
InventorDaisuke ABE
Life of this patent
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Abstract
A thin film device includes: a substrate; an electric field shielding plate formed above the substrate, the electric filed shielding plate having a conductive material; and a thin film element formed on the electric field shielding plate, the, the electric field shielding plate being connected to a potential of any electrode of the thin film element or a ground potential.
Claims9
A thin film device comprising:
- a substrate;
- an electric field shielding plate formed above the substrate and the electric filed shielding plate having a conductive material;
- and
- a thin film element formed on the electric field shielding plate, the electric field shielding plate being connected to a potential of any electrode of the thin film element or a ground potential.
1 more element
A method for manufacturing a thin film device comprising:
- forming a release layer on a transfer source substrate;
- forming an electric field shielding plate having a conductive material on the release layer;
- forming, on the electric field shielding plate, an active layer including a thin film element;
- and
- giving the release layer energy to cause at least one of interfacial peeling and in-layer peeling to thereby peeling the electric field shielding plate and the active layer from the transfer source substrate,
- the electric field shielding plate being connected to a potential of any electrode of the thin film element or a ground potential.
3 more elements
Dependencies are inferred from the claim text.