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US 2010/0301146 A1Published application
Composition of milling medium and process of use for particle size reduction
OwnerYun-Feng Changinventor
Life of this patent
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Abstract
Composition and use of milling medium to prepare a polishing medium to be used in chemical and mechanical polishing applications.
Claims12
A process of particle size reduction comprising of:
- (a) forming a slurry containing a metal oxide, a slurrying agent and optionally a slurring aid;
- (b) milling the slurry to achieve particle size reduction;
- (c) optionally using a milling medium during milling;
A process to carry out particle size reduction of target particles wherein the:
- (a) target particle containing slurry having an IEPTS;
- (b) milling medium or rotor-stator material having an IEPMM;
- (c) milling under conditions away from the IEP point of the target surface but near or close to the IEP point of the optional milling medium or milling rotor-stator
A composition of milling medium:
- (a) wherein the milling medium is selected from the group of alumina, alumina-silica, calcium oxide, ceria, iron oxide, magnesia, manganese oxide, zirconia, yttria, copper oxide, mixed metal oxide, or any combination of thereof;
- (b) the milling medium has an IEP that is at least 0.2 pH unit away from that of the target surface;
- (c) operating pH is at least 3 pH unit closer to the IEP of the milling medium;
- (d) operating pH is at least 0.2 pH unit away from the IEP of the target surface.
1 more element
A process of milling a slurry using a milling medium:
- (a) wherein the milling medium is selected from the group of alumina, alumina-silica, calcium oxide, ceria, iron oxide, magnesia, manganese oxide, zirconia, yttria, copper oxide, mixed metal oxide, or any combination of thereof;
- (b) the milling medium has an IEP that is at least 0.2 pH unit away from that of the target surface;
- (c) operating pH is at least 3 pH unit closer to the IEP of the milling medium;
- (d) operating pH is at least 0.2 pH unit away from the IEP of the target surface.
1 more element
A composition of slurry comprising of:
- (a) a target particle
- (b) a slurring agent
- (c) optionally a slurring aid.
A process for using a slurry with reduced particle size as a polishing medium to achieve chemical and mechanical polishing of surfaces resulting in:
- (a) smoothness or planarization of a target surface;
- (b) size reduction of target object;
- where the target is an article, a particle or a combination of thereof.
A process for producing a slurry comprising of:
- a plurality of metal oxide, clay, zeolite, molecular sieve, colloidal binder, surface modifier:
- (a) wherein the oxide is selected from the group of alumina, alumina-silica, calcium oxide, ceria, iron oxide, magnesia, manganese oxide, zirconia, yttria, copper oxide, mixed metal oxide, or any combination of thereof;
- (b) a milling medium is selected from the group of refractory materials including but not limited to alumina, silica, titania, ceria, zirconia, carbides, nitrides, mixed oxides or stabilized metal oxides or any combination of thereof.
Dependencies are inferred from the claim text.