Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

A bonding stage height adjustment method comprising:

• preparing a bonding apparatus comprising:
• a bonding stage for holding a bonding target on a surface thereof;
• a bonding arm configured to be rotated about a rotation center that is arranged separately from the surface of the bonding stage and to move a bonding tool attached at a tip end thereof obliquely toward and away from a surface of the bonding target in the plane of rotation thereof;
• optical position detection means having an optical axis included in a plane parallel to the plane of rotation of the bonding arm and arranged in a region on the opposite side of the rotation center with respect to a circular arc including a motion trajectory of a tip end of the bonding tool, the optical position detection means being configured to optically detect a bonding position on the bonding target;
• a reference plane lying along the surface of the bonding stage, in which an angle between the optical axis heading for the optical position detection means from the reference plane and the reference plane is equal to an angle between the motion trajectory of the tip end of the bonding tool and the reference plane;
• and
• bonding stage height adjustment means for adjusting the height of the surface of the bonding stage, and
• using the bonding stage height adjustment means to adjust the height of the surface of the bonding stage such that the reference plane is positioned between a surface of the bonding target farthest from the surface of the bonding stage and the surface on which the bonding target is placed.