A polyethylene molding composition which has a multimodal molar mass distribution, a density at a temperature of 23° C. in the range from 0.948 to 0.953 g/cm3 and an MFI190/21.6 in the range from 4.5 to 6 dg/min, and comprises from 40 to 50% by weight of a first, low molecular weight ethylene homopolymer A, from 35 to 45% by weight of a second, high molecular weight copolymer B of ethylene and another olefin having from 4 to 8 carbon atoms and from 10 to 25% by weight of a third, ultrahigh molecular weight ethylene copolymer C, with all percentages being based on the total weight of the molding compositions.