Manufacturing Method of Semiconductor Device and Laser Processing Apparatus
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsHirotada Oishi, Koichiro Tanaka
Life of this patent
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Abstract
In a manufacturing process of a semiconductor device, a manufacturing technique and a manufacturing apparatus of a semiconductor device which simplify a lithography step using a photoresist is provided, so that the manufacturing cost is reduced, and the throughput is improved. An irradiated object, in which a light absorbing layer and an insulating layer are stacked over a substrate, is irradiated with a multi-mode laser beam and a single-mode laser beam so that both the laser beams overlap with each other, and an opening is formed by ablation in part of the irradiated object the irradiation of which is performed so that both the laser beams overlap with each other.
Claims21
1-18. (canceled)
A laser processing apparatus comprising:
- a first laser oscillation device which emits a first laser beam which is a multi-mode laser beam;
- a first optical system which shapes the first laser beam and irradiates the first laser beam to an irradiated object;
- a second laser oscillation device which emits a second laser beam which is a single-mode laser beam;
- a second optical system which shapes the second laser beam;
- an optical element which divides the second laser beam passed through the second optical system and which irradiates the second laser beam to the irradiated object so that the second laser beam overlaps with the first laser beam;
- and
- a stage which holds the irradiated object and moves to a desired place.
A laser processing apparatus comprising:
- a first laser oscillation device which emits a first laser beam which is a multi-mode laser beam;
- a first optical system which shapes the first laser beam and irradiates the first laser beam to an irradiated object;
- a second laser oscillation device which emits a second laser beam which is a single-mode laser beam;
- a second optical system which shapes and divides the second laser beam;
- . a first deflector which controls a traveling direction of the second laser beam;
- a second deflector which irradiates the second laser beam to the irradiated object so that the second laser beam overlaps with the first laser beam;
- and
- a stage which holds the irradiated object and moves to a desired place.
A laser processing apparatus comprising:
- a first laser oscillation device which emits a first laser beam which is a multi-mode laser beam;
- a first optical system which shapes the first laser beam and irradiates the first laser beam to an irradiated object;
- a second laser oscillation device which emits a second laser beam which is a single-mode laser beam;
- a second optical system which shapes the second laser beam;
- an optical element which divides the second laser beam passed through the second optical system and which irradiates the second laser beam to the irradiated object so that the second laser beam overlaps with the first laser beam;
- and
- a stage which holds the irradiated object and moves to a desired place,
- wherein the first laser oscillation device and the first optical system are connected by an optical fiber.
A laser processing apparatus comprising:
- a first laser oscillation device which emits a first laser beam which is a multi-mode laser beam;
- a first optical system which shapes the first laser beam and irradiates the first laser beam to an irradiated object;
- a second laser oscillation device which emits a second laser beam which is a single-mode laser beam;
- a second optical system which shapes and divides the second laser beam;
- a first deflector which controls a traveling direction of the second laser beam;
- a second deflector which irradiates the second laser beam to the irradiated object so that the second laser beam overlaps with the first laser beam;
- and
- a stage which holds the irradiated object and moves to a desired place,
- wherein the first laser oscillation device and the first optical system are connected by an optical fiber.
Dependencies are inferred from the claim text.